Why does this white paper matter?

Fine-grain copper provides a high grain-boundary density that can support rapid atomic transport during annealing. For manufacturing integration, however, the deposit must remain stable while wafers or dies move through plating, CMP, metrology, alignment, and bonding operations. The white paper examines how the Everplate® Cu 300 process addresses this balance by stabilizing a fine-grain deposit during ambient queue time while preserving its response to bonding-relevant thermal treatment.

What you will learn
Download the white paper to explore:

  • Why hybrid bonding is gaining relevance for fine-pitch heterogeneous integration
  • How copper microstructure affects atomic diffusion and interface elimination
  • How Everplate® Cu 300 supports fine-grain stability and thermal response
  • How via geometry and seed-layer texture influence recrystallization
  • What the findings mean for W2W and D2W integration

Key findings
The reported study found:

  • Fine-grain stability during ambient storage for more than four weeks
  • Substantial grain growth after approximately two hours at 200 ± 10 °C
  • No void formation reported in the plated copper after the evaluated three-hour anneal at 300 °C
  • Complete Cu–Cu interface elimination, with no detected voids, in the evaluated Cu/Cu/Ni stack after storage at 150 °C for 500 hours
  • Improved fine-grain stability with larger via diameter and accelerated recrystallization with greater via depth in the tested structures

Target applications
The white paper findings are relevant to:

  • Wafer-to-wafer hybrid bonding
  • Die-to-wafer hybrid bonding
  • Fine-pitch 2.5D and 3D integration
  • Chiplet-based architectures
  • Memory-on-logic integration
  • High-bandwidth interposers
  • AI and high-performance computing packages

Technical credibility

The white paper summarizes SEM, FIB-SEM, and EBSD evidence used to evaluate ambient grain stability, via-geometry effects, seed-layer texture, thermal activation, and Cu–Cu interface evolution.

Complete the form to access the technical white paper. Have a specific challenge or question? Share it with our experts in the form field.