Why does this white paper matter?

Glass can support fine-line redistribution layers, tighter registration on large panels, and high-density interconnect architectures. However, its chemically inert surface, brittle construction, and high-aspect-ratio features present specific metallization challenges. 

What you will learn
Download the white paper to explore:

  • Why glass is gaining relevance for AI, HPC, and HBM packaging
  • How glass substrates compare with traditional organic materials
  • Why wet metallization can offer advantages over conventional PVD
  • How to address adhesion, seed-layer deposition, and TGV filling
  • How copper-only seed removal simplifies downstream processing
  • How the process supports glass-core substrates and glass interposers

Key processes covered
The white paper explains how three MKS’ Atotech solutions work as a connected process:

  • Vitrocoat® GI – Creates a nanometer-scale metal-oxide layer designed to promote reliable bonding between glass and copper.
  • Cupratech® GI M – Provides a uniform electroless copper seed layer with conformal coverage across large panels and high-aspect-ratio TGVs.
  • InPro® Pulse TGV – Uses pulse/reverse-pulse copper plating to support void-free TGV filling with minimal overburden.

Key process benefits

The process described in the white paper supports:

  • Electroless TGV seed coverage at aspect ratios exceeding 6:1, with development ongoing for AR 10:1 OR: Conformal electroless copper coverage for TGV aspect ratios exceeding 10:1
  • Compatibility with major glass materials
  • Fine-line patterning down to 5/5 µm line/space
  • Reduced signal loss by eliminating a titanium adhesion layer
  • Simplified copper-only seed-layer etching
  • Double-sided, multi-panel processing
  • Production sampling support through MKS’ Atotech TechCenters in Yokohama, Japan, and Guanyin, Taiwan

Target Applications

  • 2.1D glass-core package substrates - For applications requiring improved dimensional stability, reduced warpage, finer TGV pitch, and fine-line build-up structures
  • 2.5D glass interposers - For advanced packaging applications targeting improved scaling, lower signal loss, and reduced power consumption

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