Why does this white paper matter?
Even if a stacked blind microvia passes conventional inspection, it can still fail if copper recrystallization stalls or if nanovoids and impurity-rich initiation layers create a future crack path. This white paper explains how microstructure-aware reliability evaluation can help technical teams identify risk earlier and make more informed process decisions.
What you will learn
Download the white paper to understand:
- How AI-and HPC-driven packaging trends increase thermo-mechanical loading across substrates and boards.
- Why Cu/Cu/Cu junctions are critical in stacked blind microvias.
- How bottom-up and top-down recrystallization influence joint reliability.
- Why nanovoids at copper interfaces can affect crack initiation and propagation.
- How Normalized Crack Length — NCL can help compare process options before long-cycle reliability testing.
- Which process controls support more reliable HDI, mSAP, package substrate, and advanced packaging manufacturing.
Technical topics covered
The white paper includes insights into:
- Copper recrystallization behavior
- Nanovoid formation mechanisms
- Impurity segregation at copper interfaces
- Electroless and electrolytic copper initiation
- TEM/EDX and EBSD-based analysis
- Hot-oil reliability testing
- NCL-based predictive screening
- Process-control mapping to MKS’ Atotech chemistries, equipment, and digital tools
Built for Technical Teams Working On
- Advanced packaging
- HDI and mSAP manufacturing
- Package substrates
- Stacked blind microvias
- Process integration
- Reliability testing and failure analysis
MKS’ Atotech Perspective
MKS’ Atotech supports the process interactions discussed in the white paper with technologies spanning from surface treatment, desmear, metallization, electroless copper, electrolytic copper deposition, final finishing, production equipment, and digital process control. The white paper emphasizes that reliability is not determined by chemistry alone, but by coordinated control of interfaces, deposition behavior, and process conditions across the manufacturing sequence.
Complete the form to access the technical white paper.
